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2013 R&D 100 Winner
Toyota Multi-Pass Branching Microchannel Cold PlateElectric propulsion technologies are fast becoming an attractive basis for future personal transport products. Typical electrical vehicles are currently hybrids: They feature an internal combustion powerplant as well as a power electronics inverter/converter assembly that joins power conversion duties between the main direct current battery and the alternating current motor. Power semiconductors within these assemblies dissipate substantial power in the form of heat, requiring an efficient heat sink to eliminate heat fluxes of 100 W/cm2 or more. Use of single-phase, liquid-cooled heat sinks is common.

The Multi-Pass Branching Microchannel Cold Plate from Toyota Research Institute of North America is an example of a this type of heat sink, but this new design couples two coolers in parallel, allowing it to handle 24 large-area high-heat flux power semiconductor devices. The design is just one-quarter the size of the current Toyota Prius power electronics cold plate, but offers a 70% improvement in heat transfer and a 50% reduction in pumping power.

Technology
Cold plate

Developers
Toyota Research Institute of North America


Development Team

Toyota Research Institute of North America's Multi-Pass Branching Microchannel Cold Plate development team (l-r): Koji Shiozaki, Ercan M. Dede, Yan Liu.

 











The Multi-Pass Branching Microchannel Cold Plate Development Team from Toyota Research Institute of North America
Ercan M. Dede, Principal Developer
Yan Liu
Satoru Sasaki
Koji Shiozaki

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