Electronic circuits are typically integrated in rigid silicon wafers, but flexibility opens up a wide range of applications. In a world where electronics are becoming more pervasive, flexibility is a highly desirable trait, but finding materials with the right mix of performance and manufacturing cost remains a challenge. Now a team of researchers from the University of Pennsylvania has shown that nanocrystals of the semiconductor cadmium selenide can be "printed" or "coated" on flexible plastics to form high-performance electronics.
Synchrotron-based imaging has helped develop enhanced light-emitting diode (LED) displays using bottom-up engineering methods. Collaborative work between researchers from the University of Florida and Cornell University has produced a new way to make colloidal "superparticles" from oriented nanorods of semiconducting materials.
University of California, Davis researchers, for the first time, have looked inside gallium manganese arsenide, a type of material known as a "dilute magnetic semiconductor" that could open up an entirely new class of faster, smaller devices based on an emerging field known as spintronics.
NIST announced the selection of the Nanoelectronics Research Initiative (NRI), a collaboration of several key firms in the semiconductor industry, to support university-centered research for the development of after-the-next-generation "nanoelectronics" technology. NRI consists of participants from the semiconductor industry, including GLOBALFOUNDRIES, IBM, Intel, Micron Technology, and Texas Instruments.
Thanks to an ultrasensitive accelerometer—a type of motion detector—developed by researchers at the California Institute of Technology and the University of Rochester, a new class of microsensors is a step closer to reality. Instead of using an electrical circuit to gauge movements, this accelerometer uses laser light and is so sensitive it could be used to navigate shoppers through a grocery aisle or even stabilize fighter jets.
Using a new technique called HARPES, for hard X-ray angle-resolved photoemission spectroscopy, Lawrence Berkeley National Laboratory researchers have unlocked the ferromagnetic secrets of dilute magnetic semiconductors, materials of great interest for spintronic technology.
Researchers from North Carolina State University have created flower-like structures out of germanium sulfide (GeS)—a semiconductor material—that have extremely thin petals with an enormous surface area. The GeS flower holds promise for next-generation energy storage devices and solar cells.
A research team in Japan has succeeded in developing equipment that enables simple, high speed measurement of the band diagrams of organic semiconductor materials in atmospheric conditions. The device essentially combines a spectrophotometer system for studying band gaps with a photoemission yield system to examine ionized potential.
When stretched, a layer of silicon can build up internal mechanical strain which can considerably improve its electronic properties. Using this principle, engineers have developed a method which allows them to produce 30-nm-thick highly strained wires in a silicon layer. This strain is the highest that has ever been observed in a material which can serve as the basis for electronic components.
Silicon is used in components, e.g. filters or deflectors, for telecommunications. So far, however, all these components have been flat, or 2D. Researchers have developed a new etching method for these structures that results 3D microstructures in silicon. Suitable for fiber optic communications, their optical properties are adjustable at the micrometer scale.
The ability to determine the composition and physics of nanoscale materials and devices at NIST is about to improve dramatically with the arrival of a new near-field scanning microwave microscope (NSMM) design. Researchers there, using existing commercial and homemade NSMMs, have pioneered many applications, notably including determination of semiconductor dopant distribution in 2D and 3D. Now they hope to look at mechanical and magnetic resonance on the nanoscale.
University of Illinois researchers have a new, low-cost method to carve delicate features onto semiconductor wafers using light—and watch as it happens. The researchers' new technique can monitor a semiconductor's surface as it is etched, in real time, with nanometer resolution, using a special type of microscope that uses two beams of light to precisely measure topography.
Semiconductors are commonly shaped by etching with chemicals, but these methods can be . time-consuming, costly, and error-prone. A new technique from researchers at the University of Illinois, Urbana-Champaign can monitor a semiconductor’s surface as it is etched, in real time, with nanometer resolution. It uses a special type of microscope that uses two beams of light to very precisely measure topography.
A University of Arkansas physicist and his colleagues have examined the lower limits of novel materials called complex oxides and discovered that unlike conventional semiconductors the materials not only conduct electricity, but also develop unusual magnetic properties.
Within optical microchips, light finds its way through waveguides made of silicon, and is amplified with the help of other semiconductors, such as gallium arsenide and erbium. But until recent work in The Netherlands, no chip existed on which both silicon and erbium-doped material had been successfully integrated. The new chip now amplifies light up to 170 Gbit/sec.
A team researchers in Germany has succeeded in developing a highly effective and manufacturing-ready optical connection between semiconductor chips. Their “photonic wire bonding” invention, based on an optical polymer and built using a combination of 3D imaging and laser lithography, reaches data transmission rates in the range of several terabits per second.
Belgium-based semiconductor manufacturing firm imec announced Tuesday that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.
Nano-Sharp Inc., a new company founded using technology developed at the University of California Davis, plans to use silicon wafers to make razor blades and surgical tools far more cheaply than current silicon or ceramic blades. Conventional blades are made by sharpening the edge of a silicon wafer, but the company’s patented new technique creates blades across the surface of the wafer, delivering atom-scale sharpness.
Diatoms, tiny marine life forms that have been around since the dinosaurs, could finally make biofuel production from algae truly cost effective—because they can simultaneously produce other valuable products such as semiconductors, biomedical products, and even health foods. Engineers at Oregon State University concede that such technology is pushing the envelope a bit. But it's not science fiction.
According to data from a 2008 Business R&D and Innovation Survey by the National Science Foundation, businesses perform the lion's share of their R&D activity in just a small number of geographic areas, particularly the San Jose-San Francisco-Oakland area and the New York-Newark-Bridgeport area.
An international team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconductor for the first time. The method paves the way for novel new devices that could be used in quantum computing and to improve energy efficiency.
Scientists at the Norwegian University of Science and Technology report they have patented and are commercializing gallium arsenide (GaAs) nanowires grown on graphene. These semiconductors, which are being developed for market by the the company CrayoNano, are grown on atomically-thin graphene using molecular beam epitaxy.
An international research collaboration led by scientists in the U.K. has developed a new approach to quantum computing that could lead more widespread use of new quantum technologies. The breakthrough has been a move from glass-based circuitry that allowed circuits to manipulate photons to a silicon-based technology that accomplishes the same calculations using quantum mechanical effects.
On Tuesday IBM introduced a new line of mainframe computers the company calls its most powerful and technologically advanced ever. The zEnterprise EC12 mainframe server is designed to help users securely and quickly sift through massive amounts of data. Running at 5.5 GHz, IBM said the microprocessor that powers the mainframe is the fastest chip in the world.
A research team at the University of Santa Barbara has designed and fabricated a quantum processor capable of factoring a composite number—in this case the number 15—into its constituent prime factors, 3 and 5. Although modest compared to, say, a 600-digit number, the algorithm they developed was right about half the time, matching theoretical predictions and marking a milestone on the trail of building a stronger quantum computer.