Organic solar cells are a compelling thin-film photovoltaic technology in part because of their compatibility with flexible substrates and tunable absorption window. Belgium-based chipmaker imec has set a new conversion efficiency record of 8.4% for this type of cell by developing fullerene-free acceptor materials and a new multilayer semiconductor device structure.
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Bruker’s ContourSP large panel metrology system more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. It is specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing.
Last year, Samsung and rival LG Electronics, the world's top two TV makers, touted organic light-emitting diodes (OLEDs) as the future of TV. OLED screens are ultrathin and can display images with enhanced clarity and deeper color saturation. Now, Samsung has launched a giant 110-in television that reflects global TV makers' move toward ultra HD TVs, as manufacturing bigger TVs using OLED proves too costly.
A recently developed plasma-based chip fabrication technique affords chip makers unprecedented control of plasma thanks to a population of suprathermal electrons. This is critical to modern microchip fabrication, but how the beam electrons transform themselves into this suprathermal population has been a puzzle. New computer simulations reveal how intense plasma waves generate suprathermal electrons.
Semiconductor Research Corporation (SRC) has launched a new research program on hybrid bio-semiconductor systems that they hope will provide insights and opportunities for future information and communication technologies. The Semiconductor Synthetic Biology (SSB) program will initially fund research at six universities.
When a tiny droplet of liquid tin is heated with a laser, plasma forms on the surface of the droplet and produces extreme ultraviolet (EUV) light, which has a higher frequency and greater energy than normal ultraviolet. Now, for the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the 3-D shape of the plasma.
Chip-making equipment manufacturer Applied Materials is acquiring Tokyo Electron Ltd., a rival maker of equipment for production of semiconductors, flat panel displays and solar panels. The two companies said Tuesday their $9.39 billion all-stock transaction will result in the creation of a new company with a market capitalization of about $29 billion.
According to a recent study published by the National Science Foundation (NSF), businesses spent more on research and development (R&D) in 2011 than they did in 2010. The figures revealed that during 2011, companies in manufacturing industries performed $201 billion, or 68%, of domestic R&D.
A study of the photovoltaic industries in the U.S. and China shows that China's dominance in solar panel manufacturing is not driven solely by cheaper labor and government support, but by larger-scale manufacturing and resulting supply-chain benefits. Researchers say a balance could be achieved through future innovations in crystalline solar cell technology.
Electron beam (e-beam) lithography enables researchers to write very small patterns on large substrates with a high level of precision. In the Nano3 cleanroom facility at the Univ. of California, San Diego’s Qualcomm Institute, a new Vistec e-beam writer is helping to develop nanoscale transistors for integrated electronics, as well as neural probes for brain diagnostics.
In the constant push for smaller transistors, researchers have been investigating oxides with higher K, or dielectric constant, values. Materials such as germanium, hafnium, and titanium are being investigated for this role, but many prototypes leak electrons. At the National Synchrotron Light Source, x-rays are being used to probe the electronic behavior of a germanium-based transistor structure that could offer a solution.
At this week’s International Image Sensor Workshop in Utah, Belgium’s imec and Holst Centre, in collaboration with Philips Research, will present a large-area fully-organic photodetector array fabricated on a flexible substrate. The imager is sensitive in the wavelength range suitable for x-ray imaging applications.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, this week announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Something unique is happening in Fremont, California, a nondescript suburb of 217,000 tucked in the high-tech region between San Francisco and Silicon Valley: manufacturing. From Tesla Motors, making cutting-edge cars, to Solaria, making solar panels, manufacturers are drawn to Fremont by incentives including a five-year waiver on business taxes, an expedited regulatory process, proximity to Silicon Valley firms and a skilled labor force.
University of Utah metallurgists have used an old microwave oven to produce a nanocrystal semiconductor rapidly using cheap, abundant, and less toxic metals than other semiconductors. X-ray crystallography, electron microscopy, and atomic spectroscopy all helped confirm that the CZTS (copper, zinc, tin, and sulfur) semiconductor was suitable for use in a solar cell.
After China reported quarterly economic growth of 7.7% this week, global markets reacted by falling, wiping out billions of dollars in stock. The reason? Growth came in under the 8% expected by forecasters. The plunge highlighted complaints about the possible inaccuracy of Beijing's official data and the intense, possibly excessive importance traders attach to a handful of Chinese economic indicators.
Certain semiconductors, when imparted with energy, in turn emit light; they directly produce photons, instead of producing heat. This phenomenon is commonplace and used in light-emitting diodes, or LEDs. Research from the University of Pennsylvania has enabled "bulk" silicon to emit broad-spectrum, visible light for the first time, opening the possibility of using the element in devices that have both electronic and photonic components.
Researchers sponsored by Semiconductor Research Corporation (SRC) have developed a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.
In Germany, a project called MEMS2015 is underway which has the ultimate goal of developing the first-ever universal design methodology for microelectromechanical systems, or MEMS. The effort, a joint government and industry project coordinated by the Robert Bosch corporation, will improve sensors and actuators, and plug the gaps between electronics and mechanics design, manufacturing, and subsequent integration into products.
Teams of scientists from across Europe are vying for a funding bonanza that could see two of them receive more than a billion dollars over 10 years to keep the continent at the cutting edge of technology. The contest began with 26 proposals, and just four have made it to the final round, including a plan to develop digital guardian angels, an accurate model of the human brain, and better ways to produce and use graphene.
Not everything there is “high-tech”, but the annual Consumer Electronics Show is a great place to see the newest and most fanciful products to reach the market each year. From the iPotty for toddlers to the 1,600-pound (725-kg) mechanical spider and the host of glitch-ridden "smart" TVs, the International CES show is a forum for gadget makers to take big—and bizarre—chances.
After more than a decade of research, chip engineers at IBM Research have built a scalable, fab-ready microchip that successfully integrates a complete optical package built from silicon. This silicon nanophotonics breakthrough allows the new chip, which is built on an existing high-performance 90-nm CMOS fabrication line, to exceed a transceiver data rate of 25 Gbps per channel.
Synchrotron-based imaging has helped develop enhanced light-emitting diode (LED) displays using bottom-up engineering methods. Collaborative work between researchers from the University of Florida and Cornell University has produced a new way to make colloidal "superparticles" from oriented nanorods of semiconducting materials.