Researchers from Cambridge University's Cavendish Laboratory have moved an individual electron along a wire, batting it back and forth over 60 times, rather like the ball in a game of ping-pong. The technique helps retain coherence, and could be beneficial in the development of quantum computing.
3M and IBM announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.
Pilots' "automation addiction" has eroded their flying skills to the point that they sometimes don't know how to recover from stalls and other mid-flight problems, say pilots and safety officials. The weakened skills have contributed to hundreds of deaths in airline crashes in the last five years.
Plastic-based flexible electronics, produced in large volume using roll-to-roll processing, inkjet printing or spray deposition, is the "electronics everywhere" trend of the future, says Oana Jurchescu, assistant professor of physics at Wake Forest University. And the key to success in this market will be the low-cost production of large molecular structures with excellent electronic performance.
Fiber optic technology is well-established for long-distance data transmission, but efforts to use photons in microcircuits have been hampered the tendency for materials defects to deflect the signal. A new type of circuit component now allows photons to find their around these defects.
Hewlett-Packard plans to spin off its personal computer division into a separate business, according to unnamed sources in major news outlets. It marks a reversal from HP's previous stance, in March, when it denied this rumor.
Carbon nanotubes offer big promise in a small package. For instance, these tiny cylinders of carbon molecules theoretically can carry 1,000 times more electric current than a metal conductor of the same size. It's easy to imagine carbon nanotubes replacing copper wiring in future nanoscale electronics. But—not so fast.
In the aftermath of most disasters—from the terrorist attacks of Sept. 11, 2001, to this year's earthquake in Japan—communication systems have been overwhelmed, leaving people without phones and Internet when they need these tools the most. Fortunately, Georgia Institute of Technology College of Computing researchers have developed a possible solution.
The editors of R&D Magazine have opened the nominations for the 2012 R&D 100 Awards competition, which will celebrate the 50th anniversary of the awards. If your organization introduced a new product this year, or is planning to, you can begin the entry process now.
The Integrated Twin-Lens 3D Camera-Recorder, developed by Panasonic Corporation places high-definition 3D video recording a single consumer-level camera. It automatically compensates for visual disparities and capture 3D video without adjustments or external equipment.
Touch display has become ubiquitous. New touch-enabled devices—including tablets, smartphones, and laptop computers—are now introduced on an almost daily basis.
Wireless sensor nodes (WSN) have been used for decades to measure physical and environmental conditions. Small, low power, wearable sensors to monitor a patient's heart, muscle, or brain activity as they conducted their daily activities has been more challenging to develop. That is until now.
The 32-bit event-driven processor architecture from XMOS offers an alternative approach to embedded computing solutions. Instead of the operating system managing and servicing interrupts, the processor creates and looks for events.
The AMD Radeon E6760 GPU from Advanced Micro Devices Inc. targets performance-driven embedded graphics and GPU computing applications. The GPU, packaged as a multi-chip module (MCM) with a ball grid array (BGA) footprint, features 1 GB of GBBR5 memory and a power dissipation of 35 W.
As demands grow for portable sensing equipment in the medical equipment and other sectors, instrument designers will demand better power efficiency from the electronic components they specify for their instruments. ON Semiconductor believes its Q32M210 family of mixed-signal microcontrollers will fill a niche for precision measurement and monitoring.
Microphones equipped with microelectromechanical systems (MEMS) are used in most audio applications that require active noise canceling (ANC), and are found in headphones/headsets, mobile phones, laptop computers, and tablets. To distinguish its products in the MEMS microphone market, Geneva- based STMicroelectronics (ST), focused on differentiation and innovation.
Ferroelectric random access memory or FRAM, is a non-volatile memory that can retain data without power. The device operates when ferroelectric materials switch polarity in an electric field.
Omega’s new CL540ZA thermocouple simulator can be used to calibrate a thermocouple input instrument and can be used for measuring temperature in a manufacturing facility.
Heidenhain has increased the functionality of its Profibus rotary encoders. The encoders that feature the Profibus interface now support the DP-V2 encoder profile which makes them ready for robot control and production technology.
A Russian astronaut was about to release a boxy 57-pound satellite Wednesday when flight controllers called off the operation. Someone had noticed from TV images that the micro-satellite, a prototype for a series of educational satellites, was missing one of its two antennas.
With one of the fastest-aging populations in the world, Japan is using robotics to provide automated care solutions. The latest effort at RIKEN, a robot able to lift a human, relies on the first capacitance-type tactile sensors made entirely of rubber to provide the necessary soft touch.
The PyLoN series is a new line of controllerless, cryogenically cooled CCD cameras from Princeton Instruments designed for quantitative spectroscopy at high sensitivity levels.
SensorDynamics, a manufacturer of MEMS and wireless semiconductor products, announced that it was acquired by Maxim Integrated Products, a manufacturer of analog and mixed-signal semiconductor products. Maxim is paying approximately $130 million plus the assumption of about $34 million in debt to acquire SensorDynamics.
Magma Design Automation Inc., a provider of chip design solutions, announced TSMC has included the QCP extractor in TSMC’s quarterly EDA qualification report for 28-nm integrated circuits (ICs).
Researchers from North Carolina State University have developed a memory device that is soft and functions well in wet environments—opening the door to a new generation of biocompatible electronic devices.