A recent study from the Massachusetts Institute of Technology describing how graphene can be used to convert signals from optical to electrical has also been explored by engineers in Austria, who have also constructed a graphene light detector on a semiconductor chip. According to the researchers, graphene can convert all light wavelengths which are used in telecommunications.
During this week’s Intel Developer Forum, new Intel CEO Brian Krzanich announced a number of near-term changes for the company’s product line, including new LTE and 14-nm products, and a lower-power product family called Quark directed at future wearable electronics devices.
As cars become more like PCs on wheels, what's to stop a hacker from taking over yours? In recent demonstrations, hackers have shown they can slam a car's brakes at freeway speeds, jerk the steering wheel and even shut down the engine — all from their laptop computers. The hackers are...
Titanium dioxide is an inexpensive, yet versatile material. The use of titanium oxide in the electronics industry is currently being investigated. An international team of researchers has confirmed theoretically-predicted interactions between single oxygen molecules and crystalline titanium dioxide and the implications of these findings could be important for a variety of applications.
Alliance Sensors Group has released its LV-48 linear position sensors designed and sealed to IP-68 for outdoor use in the harshest conditions. The LV-48 uses a proprietary inductive technology that allows it to replace traditional DC-LVDTs, linear potentiometers, and magnetostrictive sensors in most applications.
Antennas that are capable of transmitting radio waves turn components into intelligent objects. Researchers in Germany have now found a way to embed these antennas in fiber composites. As a result, the technology also works with carbon and glass fibers.
A Personal Identity Verification (PIV) card is a government-issued smart card used by federal employees and contractors to access government facilities and computer networks. To assist agencies seeking stronger security and greater operational flexibility, NIST has made several modifications to the previous version of Biometric Data Specification for PIV cards.
The 250 Series RF transceiver module is designed for reliable bi-directional transfer of digital data over distances of up to 4 miles (6.4 km), line of sight. High output power gives the module exceptional range and helps overcome noisy environments at shorter ranges.
Featuring 1% accuracy, Honeywell Sensing and Control’s Model S Series of subminiature pressure transducers fit into tight spaces with little clearance, and accurately measure pressure ranges from 100 psi to 15,000 psi.
Researchers of the Univ. of Stuttgart have achieved a new world record in coupling efficiency between optical fibers and integrated silicon waveguides. The breakthrough, which resulted in a coupling efficiency of 87%, was based on newly developed aperiodic grating coupler structures optimized at the nanoscale.
Researchers in Switzerland have designed prototype for an image sensor based on the semiconducting properties of molybdenite. Their sensor only has a single pixel, but it needs five times less light to trigger a charge transfer than the silicon-based sensors that are currently available.
Hospitals have fretted for years over how to make sure doctors, nurses and staff keep their hands clean, but with only limited success. Now, some are turning to technology—beepers, buzzers, lights and tracking systems that remind workers to sanitize, and chart those who don't.
More than 2,500 attendees turned out for the 2013 RAPID Conference and Exposition, almost doubling last year’s attendance and reflecting widespread excitement about 3D printing and additive manufacturing, according to event organizer SME. It included attendees from nearly 30 countries and the U.S.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, this week announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Researchers in Europe have developed a new experimental system to gain accurate information on mechanical values and properties of any microelectromechanical (MEMS) device through electrical measurement. The technique works by applying a current across the device with a varying frequency and analyzes the harmonic content of the output voltage of the component parts.
Unlike the building blocks of conventional hard disk drives and memories, resistive memory cells (ReRAM) are active electrochemical components. In these cells, ions generate voltage on electrodes in a similar manner to a battery. Researchers in Europe have conducted an extensive study of ReRAMs, also described as memristors, and have found previously undiscovered sources of voltage in these devices.
Technology used in downhole applications—such as geothermal or oil-well monitoring—must endure punishing conditions, from very high temperatures to tremendous pressures. Finding a solder material that can perform in these harsh environments is a constant challenge. Researchers have recently repurposed a solder alloy once intended defense applications that has all the right properties for well tasks.
After China reported quarterly economic growth of 7.7% this week, global markets reacted by falling, wiping out billions of dollars in stock. The reason? Growth came in under the 8% expected by forecasters. The plunge highlighted complaints about the possible inaccuracy of Beijing's official data and the intense, possibly excessive importance traders attach to a handful of Chinese economic indicators.
Researchers sponsored by Semiconductor Research Corporation (SRC) have developed a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.
MicroPower Direct has released the G200EI series, a family of compact 2W, EN 60950 approved DC/DC converters. These converters are specifically designed for board level power applications that require small size, robust operation, high input/output isolation levels and low cost.
ACCES I/O Products, Inc. has announced the release of a new family of PCI-104 serial communication boards—the 104I-COM-8SM Series. These PCI-104 boards feature a selection of 8, 4, or 2-ports of field selectable RS-232, RS-422, and RS-485 asynchronous serial protocols on a port by port basis.
Sensor and encoder manufacturer SICK has recently launched the AFS60 and AFM60 absolute encoders with Industrial Ethernet. These dual-port Industrial Ethernet encoders provide EtherNet/IP, PROFINET RT and EtherCAT connectivity.
A research team in Austria has developed an entirely new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The new imager, which resembles a flexible plastic film, uses fluorescent particles to capture incoming light and channel a portion of it to an array of sensors framing the sheet. With no electronics or internal components, the imager’s elegant design makes it ideal for a new breed of imaging technologies.
The size of electronic components is reaching a physical limit. While 3D assembly can reduce bulk, the challenge is in manufacturing these complex electrical connections. Biologists and physicists in France have recently developed a system of self-assembled connections using actin filaments for 3D microelectronic structures. Once the actin filaments become conductors, they join the various components of a system together.
In Germany, a project called MEMS2015 is underway which has the ultimate goal of developing the first-ever universal design methodology for microelectromechanical systems, or MEMS. The effort, a joint government and industry project coordinated by the Robert Bosch corporation, will improve sensors and actuators, and plug the gaps between electronics and mechanics design, manufacturing, and subsequent integration into products.