Equipped with a new generation of drivers, the RM05-8A-S PCB mount reed relay module from Standex-Meder Electronics offers a 24% smaller footprint than the RM05-8A model. It is ideal for test and measurement, high frequency and telecommunications applications.
Two of the key instruments aboard NASA’s Curiosity rover on Mars are the CheMin, a mineral sample analyzer, and the ChemCam, a spectroscopic imaging system. Both systems require precise, fast motion control, capable of surviving a harsh environment. Jet Propulsion Laboratory engineers found a solution with piezo-based technology from Physik Instrumente and miCos. But first it would need to pass rigorous testing.
A recently developed plasma-based chip fabrication technique affords chip makers unprecedented control of plasma thanks to a population of suprathermal electrons. This is critical to modern microchip fabrication, but how the beam electrons transform themselves into this suprathermal population has been a puzzle. New computer simulations reveal how intense plasma waves generate suprathermal electrons.
Belgian nanoelectronics research center Imec and JSR, a materials company based in Tokyo, Japan, announce that they have successfully used JSR’s innovative PA (Photo-patternable Adhesive) material for wafer-scale processing of lab-on-chip devices. Using this material, imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics.
Semiconductor Research Corporation (SRC) has launched a new research program on hybrid bio-semiconductor systems that they hope will provide insights and opportunities for future information and communication technologies. The Semiconductor Synthetic Biology (SSB) program will initially fund research at six universities.
In a record-setting experiment, researchers with the Millilink project in Germany transmitted 100 Gbits/sec of data at a frequency of 237.5 GHz over a distance of 20 m in the laboratory. The scientists applied a photonic method to generate the radio signals at the transmitter. After radio transmission, fully integrated electronic circuits were used in the receiver.
Chip-making equipment manufacturer Applied Materials is acquiring Tokyo Electron Ltd., a rival maker of equipment for production of semiconductors, flat panel displays and solar panels. The two companies said Tuesday their $9.39 billion all-stock transaction will result in the creation of a new company with a market capitalization of about $29 billion.
According to a recent study published by the National Science Foundation (NSF), businesses spent more on research and development (R&D) in 2011 than they did in 2010. The figures revealed that during 2011, companies in manufacturing industries performed $201 billion, or 68%, of domestic R&D.
A recent study from the Massachusetts Institute of Technology describing how graphene can be used to convert signals from optical to electrical has also been explored by engineers in Austria, who have also constructed a graphene light detector on a semiconductor chip. According to the researchers, graphene can convert all light wavelengths which are used in telecommunications.
During this week’s Intel Developer Forum, new Intel CEO Brian Krzanich announced a number of near-term changes for the company’s product line, including new LTE and 14-nm products, and a lower-power product family called Quark directed at future wearable electronics devices.
Titanium dioxide is an inexpensive, yet versatile material. The use of titanium oxide in the electronics industry is currently being investigated. An international team of researchers has confirmed theoretically-predicted interactions between single oxygen molecules and crystalline titanium dioxide and the implications of these findings could be important for a variety of applications.
Alliance Sensors Group has released its LV-48 linear position sensors designed and sealed to IP-68 for outdoor use in the harshest conditions. The LV-48 uses a proprietary inductive technology that allows it to replace traditional DC-LVDTs, linear potentiometers, and magnetostrictive sensors in most applications.
Antennas that are capable of transmitting radio waves turn components into intelligent objects. Researchers in Germany have now found a way to embed these antennas in fiber composites. As a result, the technology also works with carbon and glass fibers.
A Personal Identity Verification (PIV) card is a government-issued smart card used by federal employees and contractors to access government facilities and computer networks. To assist agencies seeking stronger security and greater operational flexibility, NIST has made several modifications to the previous version of Biometric Data Specification for PIV cards.
The 250 Series RF transceiver module is designed for reliable bi-directional transfer of digital data over distances of up to 4 miles (6.4 km), line of sight. High output power gives the module exceptional range and helps overcome noisy environments at shorter ranges.
Featuring 1% accuracy, Honeywell Sensing and Control’s Model S Series of subminiature pressure transducers fit into tight spaces with little clearance, and accurately measure pressure ranges from 100 psi to 15,000 psi.
Researchers of the Univ. of Stuttgart have achieved a new world record in coupling efficiency between optical fibers and integrated silicon waveguides. The breakthrough, which resulted in a coupling efficiency of 87%, was based on newly developed aperiodic grating coupler structures optimized at the nanoscale.
Researchers in Switzerland have designed prototype for an image sensor based on the semiconducting properties of molybdenite. Their sensor only has a single pixel, but it needs five times less light to trigger a charge transfer than the silicon-based sensors that are currently available.
Hospitals have fretted for years over how to make sure doctors, nurses and staff keep their hands clean, but with only limited success. Now, some are turning to technology—beepers, buzzers, lights and tracking systems that remind workers to sanitize, and chart those who don't.
More than 2,500 attendees turned out for the 2013 RAPID Conference and Exposition, almost doubling last year’s attendance and reflecting widespread excitement about 3D printing and additive manufacturing, according to event organizer SME. It included attendees from nearly 30 countries and the U.S.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, this week announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Researchers in Europe have developed a new experimental system to gain accurate information on mechanical values and properties of any microelectromechanical (MEMS) device through electrical measurement. The technique works by applying a current across the device with a varying frequency and analyzes the harmonic content of the output voltage of the component parts.
Unlike the building blocks of conventional hard disk drives and memories, resistive memory cells (ReRAM) are active electrochemical components. In these cells, ions generate voltage on electrodes in a similar manner to a battery. Researchers in Europe have conducted an extensive study of ReRAMs, also described as memristors, and have found previously undiscovered sources of voltage in these devices.
Technology used in downhole applications—such as geothermal or oil-well monitoring—must endure punishing conditions, from very high temperatures to tremendous pressures. Finding a solder material that can perform in these harsh environments is a constant challenge. Researchers have recently repurposed a solder alloy once intended defense applications that has all the right properties for well tasks.
Researchers sponsored by Semiconductor Research Corporation (SRC) have developed a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.