During this week’s Intel Developer Forum, new Intel CEO Brian Krzanich announced a number of near-term changes for the company’s product line, including new LTE and 14-nm products, and a lower-power product family called Quark directed at future wearable electronics devices.
There are various boxes today that bring Internet content to TV sets, with popular ones made by...
Probe storage devices read and write data by making nanoscale marks on a surface through physical...
Researchers at the Stanford University School of Medicine and Intel Corp. have collaborated to...
Broadly speaking, the two major areas of research at Massachusetts Institute of Technology's Microsystems Technology Laboratory are electronics—transistors in particular—and microelectromechanical systems, or MEMS—tiny mechanical devices with moving parts. Both strains of research could have significant implications for manufacturing in the United States, but at least for the moment, the market for transistor innovation is far larger.
Plessey Semiconductors announced that it has agreed to a product licensing agreement with Intel Corp. and a share warrant agreement with Intel Capital. Under the terms of the licensing agreement, Plessey will be licensed to manufacture, sell, and support a select number of products in Intel's digital tuner portfolio.
For nearly half a century, Stephen Hawking has lived with Lou Gehrig's disease, an incurable degenerative disorder that has left him almost completely paralyzed. An infrared sensor translates pulses in his right cheek into words spoken by a voice synthesizer, but those nerves have deteriorated. A research project by Intel has been formed to help him communicate more effectively.
Replacing traditional, slower hard disk drive (HDD) storage technology in the data center, Intel's Solid State Drive 710 Series (Intel SSD 710) is a purpose-built data center SSD that uses computer-quality Intel 25 nm multi-level cell (MLC) NAND Flash memory with Intel High Endurance Technology (HET).
Intel Corporation and Micron Technology Inc. announced a new benchmark in NAND Flash technology—the world's first 20 nm, 128 Gb, multilevel-cell (MLC) device. The companies also announced mass production of their 64 Gb 20 nm NAND, which further extends the companies' leadership in NAND process technology.
The University of Tennessee's National Institute for Computational Sciences announced at the SC11 conference that it has entered a multi-year strategic engagement with Intel Corporation to pursue development of next-generation, high-performance computing solutions based on the Intel’s Many Integrated Core architecture.
Researchers from North Carolina State University are developing a 3D central processing unit (CPU) with the goal of boosting energy efficiency by 15 to 25%. The work is being done under a $1.5 million grant from the Intel Corporation.
Intel Capital announced a $300 million Ultrabook Fund to help drive innovation in this new category of devices. Ultrabook systems will marry the performance and capabilities of today's laptops with tablet-like features.
Japan’s K supercomputer stole the spotlight at the International Supercomputing Conference in Germany Monday by claiming pole position in the Top500 supercomputer list, but Intel had its own big news. With the help of SGI, a technical computing expert, the company claims it will achieve the quintillion computer operations per second barrier by 2020. This performance would be a hundred times the level of today’s supercomputers.
Justin Rattner, Intel’s CTO and an R&D Magazine Scientist of the Year, this week unveiled more than 35 innovative research projects at the company’s annual Research at Intel event in California. The work, which involves dozens of industry and academic partners, offers a glimpse at near-future computing advances, includes many-core processing, cryptography, and wireless energy sensing.
The breakthrough 3-D tri-gate transistor Intel showcased on Wednesday is a breakthrough, mainly because chip designers have nowhere else to go on a 2-D surface. The miniscule fins add computing power without adding chip size, just as skyscrapers maximize use of land. Intel's advance does not add a complete third dimension to chip-making, but that remains a distant but hotly pursued goal of the industry.
Since their invention by Bell Labs more than 50 years ago, transistors have almost always been “flat”. By adding a third dimension — "fins" that jut up from the base — Intel says it will be able to make both transistors and chips smaller. Chips with the 3-D transistors will be in full production this year and appear in computers in 2012.
Maligned as too power-hungry for small mobile devices, Intel’s chip technology is in the midst of realignment as Intel is trying to elbow in to a mobile market dominated by lower-power processors from companies such as Qualcomm and Texas Instruments. The new chip is slated for release later this year.
Xradia, a California-based manufacturer of computed tomography instrumentation, introduced this week the VersaXRM-500, a 3-D x-ray microscope that delivers submicron spatial resolution with a working distance of millimeters to inches from the source. The instrument may speed development of 3-D interconnect technology for the semiconductor industry.
The President visited Intel Hillsboro's Ronler Acres facility as part of a West Coast technology tour last week. During his visit to the TEM lab, the president took a seat at the facility's FEI Titan and had a look at atoms at the sub-Angstrom level.
The official 2009 introduction of 32-nm lithography node was an expected milestone in the history of computer processor technology; but the transition, led by the Intel 32nm process technology, required a number of technological breakthroughs before Moore’s Law could be successfully defended.
According to a report on Monday, Intel’s Atom processor is becoming a sales monster, driving a record for shipments in a single quarter. One normally wouldn’t expect that sort of performance from Intel’s slowest, smallest chip, but cost and power consumption have a lot to do with it. The bigger story, perhaps, is that many of these chips won’t ever see the inside of a laptop.
Intel Corporation’s (Santa Clara, Calif.) Intel Atom Processor, featuring Intel's smallest processor and built with the world's smallest transistors, gives device makers and software vendors the ability to innovate around a low-power design that enables users to take the Internet wherever they go.
At an Intel laboratory, R&D Magazine ’s 2008 Scientist of the Year is designing the chips that are revolutionizing photonics and pointing the way to the terascale age of optical communications.
Gates control the opening and closing of these transistors, which are insulated from the gate by a dielectric. Intel Corp. (Santa Clara, Calif.) saw an opportunity to reduce this transistor leakage and developed the Intel 45 nm High-k Metal Gate Transistor Technology for its new 45-nm process chips.
The skyrocketing popularity of online downloads continues to emphasize the need for faster connectivity levels. The 10-Gigabit Ethernet Adapter, developed by researchers at Intel Corp., Austin, Texas, and Los Alamos National Laboratory, N.M., has the potential to transfer information from one computer to another up to 148,000 times faster than a high-speed modem connection and 23,000 times faster than a DSL connection.