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Posted In: Materials Processing | Materials Science | Thin films | Material Science | Materials | Materials
Wednesday, February 3, 2010
Processing UNCD for incorporation at wafer scale into devices uses the same equipment as for processing silicon (Si). Patterning of UNCD may be done via a hard mask gas etching (see recipe on next page). Diamond windows may be created by backside etching the silicon from the UNCD Wafer. The following UNCD property data provides some starting points for creating devices using UNCD wafers.
A guide to creating a MEMS device from diamond
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Apr 12
According to JEOL Resonance, a new benchmark for resolution and benchmark will be set with its introduction next week of a new 0.75-mm solid state nuclear magnetic resonance (NMR) probe. The probe is capable of high resolution sample analysis by spinning the sample at 110 kHz, the world's fastest spinning speed for NMR.
12/1/2011
Nextreme Thermal Solutions has developed two new energy harvesting subsystems for the plumbing and HVAC industries. The subsystems are the latest additions to Nextreme's Thermobility energy harvesting platform that uses thin-film thermoelectric technology to convert available thermal energy into electric power for a variety of autonomous self-powered applications.
17 hours ago
Leica Microsystems has introduced the Leica DM4000 B LED, a microscope system with LED illumination suited for biomedical applications.
Gilson Inc. has introduced the GX-241 liquid handler, a compact liquid handler suited for application and laboratories where bench space is at a premium.
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3 hours ago
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