XSiL Launches Next Generation of Laser Dicer for Thin Wafers
XSiL has launchedits new laser dicing system specifically designed to process thin silicon wafers. The X300D+, developed on the company’s Xise300 platform, includes four integrated processes. First, a non-ionic, water-soluble coating is dispensed onto the wafer for high-performance protection. Second, the wafer is diced using a high-powered UV DPSS laser at 355nm; silicon and DAF are cut with minimal damage and no chipping at high speed. The third process is wafer cleaning inside the wash station, to remove coating and debris. The final step is an innovative low-cost dry-etch process called MaxFlex.
XSiL Ltd
Silverstone House, Ballymoss Road
Sandyford, Dublin 18
|
