Interposers Enable Use of Lead-free BGA Devices
New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, tin/lead solder profiles. Designed for RoHS exempt applications, interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. Advanced’s turn-key solution consists of lead-free BGA device attach to an interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) tin/lead solder balls on the bottom of the Interposer. The compact interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change tin/lead solder profiles or subject other components to higher processing temperatures.
Advanced Interconnections Corp.
5 Energy Way, Box 1019
West Warwick, RI, 02893
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