Next-Generation Optical Metrology System
Veeco Instruments Inc. has released its latest generation of products for backend semiconductor metrology. The Wyko SP9900 Surface Profiling System performs critical measurements that support high yield and device reliability for advanced high-density interconnect (HDI) packages.
The SP9900 monitors critical parameters in multilayer organic panels manufactured for flip chip pin grid array and flip chip ball grid array-type packages. Measurements include critical dimensions, trace heights, via depths, and roughness of the layers in laminate packages, as well as analysis of solder bump arrays. A simple-to-use, production interface allows integration into high-volume manufacturing environments, providing minimal operator-to-operator variability while delivering an advanced engineering mode for process development.
Veeco Instruments Inc.
Terminal Drive
Plainview, NY, 11803
|
