Microbolometer from Raytheon
Specified for use in manufacturing Raytheon’s focal plane
arrays for air, space and terrestrial applications, the Ziptronix
technology provides true 3D integration of multilayer CMOS
structures, enabling 100% pixel operability within the focal
plane.
'We believe that low temperature oxide bonding technology
will pave the way for low cost 3D IC integration for the
foreseeable future," said Dan Donabedian, CEO
of Ziptronix, Inc. 'In addition to high reliability military
focal plane arrays, our technology has the potential for use in
high volume consumer electronics applications such as cell phone
cameras and digital cameras."
Ziptronix, Inc., based in Research Triangle Park, NC, is a
leader in IP for innovative 3D integration technology for advanced
CMOS ICs, with established patent protection for its ZiBond™
low temperature covalent bonding (US Patent 7,387,944) and DBI®
direct bond interconnect (US Patent 6,962,835) technologies.
Ziptronix’ DBI technology enables reliable, repeatable,
low cost wafer-to-wafer or die-to-wafer bonding without the need
for high temperature compression techniques that can lower yields
and raise processing costs. A key feature in the Ziptronix
technology is the ability to use several DBI metals, including
nickel or copper, to reliably interconnect to copper, tungsten or
aluminum TSVs, while providing for adequate planarity of the
oxide/metal interface to achieve a strong, reliable bond.
This process supports both backside and frontside interconnects,
maximizing the density of electrical connections between the
separate layers and extending bandwidth by alleviating interconnect
delays with scalable 3D routing.
For more information about Ziptronix’ 3D IC technology and
its licensing agreement with Raytheon Vision Systems, contact Chris
Sanders at c.sanders@ziptronix.com,
call 919-459-2444 or visit www.ziptronix.com.
About Ziptronix:
Ziptronix is a pioneer in the development of low
temperature oxide bonding technology for advanced semiconductor
applications. Founded in October 2000, Ziptronix was spun out
from North Carolina’s RTI International for the purpose of
commercializing their revolutionary wafer and die bonding
(ZiBond™) and interconnect (DBI®) technologies. The
company has an extensive worldwide patent portfolio covering the
fundamental concepts behind economical low temperature oxide
bonding.
Ziptronix technology provides the lowest cost solution for low
temperature wafer-to-wafer and die-to-wafer bonding, delivering
significant advantages in size reduction, lower production costs,
lower power consumption and increased system performance.
Ziptronix licenses its technology to customers across the entire
semiconductor manufacturing supply chain – OEMs/IDMs,
foundries, semiconductor equipment manufacturers and OSATs –
to enable them to quickly implement reliable, economical 3D IC
integration using standard processing equipment.
http://www.ziptronix.com
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