Tuesday, October 27, 2009
Master Bond's
newly developed EP29LP-1 epoxy is an attractive potting compound
for use in large potting and encapsulating applications. Presenting
a gamut of significant potting properties, good compound flow, easy
set up and convenient handling, it exhibits a remarkably low
exotherm, maximum pot life and desired electrical insulative
qualities .
The very long working life at ambient temperatures exceeds 6
hours and qualifies this compound for filament winding
applications. Its excellent physical strength properties enhance
component resistance to thermal shock and it has excellent
resistance to chemicals such as fuels, acids, bases, water and
salts.
EP29LP-1 is a low viscosity, two part, optically clear epoxy
designed to adhere to many substrates, including optical fibers and
fibrous reinforcements such as glass, aramid, and graphite. The low
viscosity speeds impregnation and facilitates air release. The
availability of versatile cure schedules- ambient temperature or
accelerated elevated temperature cures, further simplifies
manufacturing applications.
The bond strength of EP29LP-1 is greater than 3,500 psi,
assuring durable and long lasting performance. It has a peak
exotherm as low as 50°C to help avoid excess heat buildup and
damage to thermally sensitive components. Extended operating
temperature ranges from -100°F to 250°F.
SOURCE