2010 R&D 100 Winner
Prior to the introduction of the Flip-Chip Wireless Front-End Integrated Circuit (FEIC) from Epic Communications, Inc., Taiwan, radio frequency (RF) chips for smart phones and mobile Internet devices had lead frame and laminate packaged front-end modules (FEM), which used multiple discrete chips and bond wires within.
The FM2491-FC is a standalone flip-chip for on-board SMT and SiP assembly processes, labeled by its developer as the smallest complete RF front-end integrated solution. It measures 1.5 by 0.9 by 0.3 mm (an 80% reduction over similar devices) and has no metal bond wires. It integrates a WiFi/BT-based 2.4 GHz power amplifier, a highly linear SP3T switch, a high pass filter, on-board power detector, temperature compensation circuit, CMOS compatible control logistics, and input/output matching circuitry and biasing components.
With space at a premium in mobile devices, Epic Communications was able to shrink the footprint for the RF chip by using on-wafer dual HBT/pHEMT process integration and copper pillar bumping technology.
Technology
RF integrated circuit
Developers
Epic Communications, Inc.
Development Team
|
| (l-r): Duc Chu, Cindy Yuen, and Yi-Ching Pao |
The Flip-Chip Wireless Front-End Integrated Circuit Development Team from Epic Communications, Inc.
Duc Chu
Kirk Laursen
Yi-Ching Pao
Cindy Yuen
