2009 R&D 100 Winner
CarAl heat transfer material, developed by Applied Nanotech Inc., Austin, Texas, and Advanced Material Technologies Co. Ltd., Fuji-shi, Shizuoka, Japan, overcomes technical impasses of conventional heat transfer materials in its combination of heat diffusivity, high heat conductivity, low density, and thermal coefficient of expansion similar to electronics packaging materials. These properties were achieved by creating proper alignment of carbonaceous material for diffusivity and conductivity and tailoring the porosity; impregnating the carbon pores with metal; and adding a dopant to the metal to prevent corrosion and formation of insulation. The end result is a material that can remove heat quickly from a heat source, preventing “hot spots” and thermal flux. The CarbAl material does not expand and contract as much as traditional heat sink materials so it is not a thermal mismatch and does not create related stresses.
Technology
Heat transfer material
Developers
Applied Nanotech Inc.
Advanced Material Technologies Co. Ltd.
