Monday, September 1, 2003
2003 R&D 100 Winner
Transmission x-ray microscopes (TXM) have not been known for their high resolution, especially when compared to scanning electron microscopes (SEM). Their advantage lies in their ability to image relatively thick samples. Researchers at Xradia, Concord, Calif., are testing these boundaries with the introduction of the TXM 54-80 Tomographic Imaging X-ray Microscope. The TXM 54-80 is a tabletop transmission x-ray microscope capable of imaging semiconductor integrated circuit chips (ICs) in 2-D at a spatial resolution better than 80 nm, in a 20 µm field of view. The TXM utilizes absorption differences between different materials found in the IC for image contrast with the aid of a zone-plate circular diffraction grating (x-ray lens) that can provide a 30x magnification. It can nondestructively image a full stack or partially deprocessed ICs.
The device offers users several operating modes, 2-D transmission imaging and stereo imaging, which have processing times of 10 and 20 min, respectively. The third mode, 3-D reconstruction, allows chipmakers to survey a full 3-D tomographically reconstructed image of the circuit within 8 hr.
Technology
Tabletop transmission x-ray microscope
Developer
Xradia
